The latest adhesive technology innovation solution

Rubber giant Henkel's latest adhesive technology innovation solution grabs the prophet

Rubber giant Henkel's latest adhesive technology innovation solution grabs the prophet

April 2, 2021

on March 17, 2021, the 2021 semicon China, an industry event for the domestic semiconductor industry, was held in Shanghai. During the exhibition, Cheng Gang, the sales director of semiconductor China of Henkel electronics division, accepted the new materials ® In the interview, I also had in-depth views on the word "innovation". "Innovation is the gene or blood of the semiconductor industry. Henkel has been helping to solve industry challenges with new technologies and creating more updated application needs with leading solutions." He said

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Henkel appeared in 2021 semicon China

Cheng Gang introduced to the media that at this exhibition, Henkel, as an adhesive expert in the semiconductor industry, focused on the advanced packaging technology of systematic packaging, the processing technology of chip stacking in memory, gallium nitride and silicon carbide technology, compact camera modules and smart electronic material adhesive solutions that promote the bonding of 3D camera modules, And conducted in-depth exchanges and further explanations in the follow-up interviews

advanced packaging technology - system level packaging solutions

with the continuous development of emerging industries such as artificial intelligence, autonomous driving, 5g networking, IOT, and the gradual evolution of mobile electronic products to lightweight, multifunctional and low power consumption, the market demand for high performance, small size, high reliability and ultra-low power consumption of chips and electronic products is also growing

according to the report of China Academy of communications technology, from January to November 2020, the total domestic market shipments totaled 281 million, of which 144 million were 5g, accounting for 51.4%. This is also the first time that 5g has exceeded 4G in the annual span

"last year was actually the first year of 5g. The number of chips contained in 5g is far greater than 4G, which will promote stronger and stronger demand for the entire semiconductor industry." When asked about the development trend of the semiconductor industry this year, Cheng Gang told new materials ® Introduced

among many packaging technologies related to 5g applications, the application demand of flip chip technology is more and more extensive, followed by higher requirements for underfill materials, which not only ensure the good adhesion between the protective cover or reinforcement and the substrate, but also reduce the warpage of chips and packages under thermal load

for this reason, Henkel has launched a capillary bottom filler Loctite ECCOBOND UF 9000ae, a protective cover and Agilent reinforcement bonding adhesive Loctite Ablestik ce3920, and a semi sintered chip bonding adhesive Loctite Ablestik ABP 8068tb12 for power ICs and discrete devices to meet higher heat dissipation requirements

advanced packaging technology solution

loctite ECCOBOND UF 9000ae has no resin aggregation and filler precipitation after use, and its excellent rapid fluidity can achieve higher production capacity and lower process cost; Loctite Ablestik ce3920 has excellent workability, excellent adhesion and high conductivity, and can connect the heat sink to the back of the chip without using a protective cover; Loctite Ablestik ABP 8068tb12 has good sintering performance when used in silver, PPF and gold substrates. It has no resin overflow, high thermal stability and good electrical stability. It can meet higher heat dissipation requirements and realize system level packaging

memory device technology - designed for stacking packaging

as one of the three pillars of the semiconductor industry, memory is an important part of semiconductor components and plays a key role in the design trend and development of electronic products towards light, thin, short and small

in order to increase the function of memory chips without increasing the package volume, the industry often uses wafer with relatively thin processing thickness to stack the chips, so that the performance of electronic products is increased and the volume of products is reduced, which is actually very challenging

in order to meet the evolving chip stacking requirements, thinner wafers are essential, so effective processing and processing 25 μ M to 50 μ M thick wafer becomes very important

the non-conductive chip bonding film Loctite Ablestik ATB 100md8 introduced by Henkel can be used in wafer lamination process or as a preform decimal, which is specially designed for mother child (multi-layer) chips used for stacking packaging. Its stable wafer cutting and chip pickup performance is suitable for thin large chip applications, and can effectively help the production of today's storage devices

at the same time, in order to fit the current popular stacking packaging of low-power storage devices, Henkel also introduced the non-conductive chip bonding film Loctite Ablestik ATB 100dr3, which can have excellent lead penetration and wrapping performance in different chip bonding parameter environments, and has high reliability

in addition, as a transparent two in one adhesive film, Henkel's pre filled bottom filled non-conductive film Loctite Ablestik NCF 200 series can control a very small amount of glue overflow. It is specially designed to support tight layout, low height copper pillars and lead-free, low k, small spacing, large size and thin flip chip design, which can protect the conductive bumps in the TCB process

gallium nitride and silicon carbide - high power chip bonding solution

with the introduction of the "14th five year plan", the development of new infrastructure will be carried out in an all-round way. "New infrastructure" is not only connected with the upgrading consumer market, but also with the rapid development of industrial reform and technological innovation, and the development and construction of these industries are closely related to the development of semiconductor technology

the third generation semiconductor materials represented by gallium nitride and silicon carbide are the core materials supporting the "new infrastructure". These materials have higher bandgap width, high breakdown voltage, conductivity and thermal conductivity. They will replace the previous two generations of semiconductor materials in the fields of high temperature, high voltage, high power and high frequency. Therefore, they are also more suitable for making high temperature, high frequency, radiation resistance and high-power devices

it is reported that gallium nitride and silicon carbide materials are used in new energy vehicles, RF, charging piles, base station/data center power supply, industrial control and other fields, and have great development prospects and market opportunities

for this field, Henkel has introduced two chip bonding materials characterized by high reliability and high conductivity and heat conduction. One is Loctite Ablestik SSP 2020 all silver sintered chip bonding adhesive, which not only has high conductivity and heat conductivity, but also has the characteristics of long working time and good processability

the other is Han Gaoxin's first generation Loctite Ablestik ABP 8068t series semi sintered chip adhesive, which can be connected through sintered metal to ensure the reliability of device operation

camera module technology - achieve higher imaging quality

with the vigorous development of intelligence, the camera has been upgraded from hundreds of thousands of pixels to hundreds of millions of pixels, and high-definition pixels also put forward higher requirements for camera assembly. The first is the bonding requirements for the outsole and high-pixel image sensor chips

in order to solve the problems of chip warpage and difficult matching between lens and lens barrel encountered in the traditional assembly process of large-scale image sensors with high fatigue life up to 50000 times, Henkel has launched a chip adhesive for large CMOS sensors, which is suitable for flat warpage (-3~3) after rapid curing μ m) Loctite Ablestik ABP 2042aa and smile warpage (-4~0) after rapid curing μ m) Loctite Ablestik ABP 2043

Henkel compact camera module solution

for different sizes of chips and lens devices with different warpage degrees, Henkel's chip adhesive can provide warpage performance in different gradient intervals to avoid problems such as virtual focus and deformation of the lens due to mismatched warpage degrees

it is reported that this series of products can realize the characteristics of curing as low as 95 ° C and 3 minutes at the fastest, effectively alleviate the impact of thermal process on the overall module, and solve the deformation problem from the source. In addition, good thermal conductivity can also effectively alleviate the "high fever" problem of large-size chips working for a long time

judging from the intelligence launched by manufacturers in recent years, its camera module includes many parts, such as image sensor, mirror base, lens, circuit board, etc. After many times of assembly, the superposition work difference is getting larger and larger

the traditional assembly method cannot freely adjust the impact of these errors, resulting in virtual focus and uneven definition of various areas after camera assembly. In order to correct the mechanical error of each component, AA (active alignment) process, namely active alignment process, has become the first choice of manufacturers

therefore, Henkel has launched a new generation of lens support adhesive LOCT for active lens alignment, which has high requirements on the moisture content of the base course, base grinding and primer treatment, ite Ablestik NCA 2286ad and Loctite Ablestik NCA 2286ae. This series of products have high viscosity and thixotropy, so that the glue line has a higher aspect ratio, high adhesion and reliability, so that the final assembly can be adjusted more easily, making great contributions to the excellent performance of the camera

3d TOF sensor - helps cameras enter the 3D era

with the progress of technology, now people can realize virtual reality scenes with only a tablet computer, or even an intelligent one, without complex acquisition equipment and high-cost data processing. The key to this technology is the 3D TOF sensor camera module

unlike ordinary camera modules, 3D cameras have new components such as laser emitters and diffractive optical elements, and the actual volume of the modules is often smaller than that of mainstream cameras. In addition, the laser control chip of 3D camera module will generate a lot of heat in a small area. This requires high thermal conductivity and high reliability chip adhesive

new components need special care. Henkel's Loctite Ablestik ABP 8068tb chip adhesive is suitable for receiving sensors with high thermal conductivity on different substrate surfaces. The high silver content gives it good conductivity and thermal conductivity, and has excellent workability, high adhesion and high reliability, making it very suitable for the bonding of excitation control chips

at the same time, because the inside of the support is a closed area, if the heating and curing temperature is too high, the internal air pressure will rise, which is easy to break the glue, so that there is an opportunity for foreign matters to flow into the camera

to solve this problem, Henkel has introduced Loctite Ablestik NCA 2370b, which is used for the bonding of brackets on various sensors. Its low-temperature curing feature has excellent adhesion to various substrates, avoiding foreign matters from flowing into the interior, and has high reliability

on the whole, it is obvious to all how broken Henkel is, and how innovative it is to keep pace with the times. When it comes to Henkel's future development plan, Cheng Gang is full of confidence. "Innovation has given new vitality to the market and promoted the growth of new demand. New energy vehicles, autonomous driving, ar/vr, etc. are all new demands created by science and technology; with the help of innovative genes, Henkel is bound to take more solid development steps in more fields."

Henkel has more than 100 years of professional experience in innovative adhesive technology. In view of the opportunities and challenges of localization in China in recent years, Henkel will continue to adhere to the development strategy of "in China" and "for China", help customers solve challenging problems, and actively work for different industries with the strong support of innovative ideas, professional technology, global resources and localized production and research and development in China